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IPC Honors Shennan Circuits Company and Foxconn with Corporate Recognition Awards
March 20, 2025 | IPCEstimated reading time: 1 minute
IPC presented its highest corporate honors to two IPC member companies, Shennan Circuits Company (SCC) and Foxconn, during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2025. The Peter Sarmanian Corporate Recognition Award was presented to SCC, and the Stan Plzak Corporate Recognition Award was presented to Foxconn.
The Peter Samarian Corporate Recognition Award recognizes an IPC-member company in the printed circuit board (PCB) industry that has supported IPC through participation in technical and management programs while providing leadership for the industry.
SCC, headquartered in Shenzhen, Guangdong, China, is a leader in China’s packaging substrate field and electronic assembly manufacturing. Since 2008, SCC has actively engaged in IPC standards development and certification training. SCC embeds IPC standards into its employee training programs, strengthening professional expertise and optimizing quality management processes. They also actively participate in IPC CEMAC, a yearly event promoting international exchange and cooperation in electronics manufacturing.
The IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry (EMS) that actively contributes to the industry while supporting IPC technical and management programs.
Foxconn, established in Taiwan in 1974, is the largest EMS company in the world. An IPC member since 2009, Foxconn actively participates in the development of IPC standards, standards promotion, and talent development. Strong supporters of IPC’s sustainability initiative, Evolve, Foxconn developed IPC-1401 and IPC-1402, two leading sustainability standards, and the global implementation of the IPC-CFX standard. They have invested substantially in workforce development, training, and certifying professionals to IPC standards.
“SCC and Foxconn have consistently provided staff resources for standards development and other IPC programs and initiatives,” said John W. Mitchell, IPC president and CEO. “Their involvement has directly contributed to IPC’s global growth in the electronics industry, and we are pleased to recognize these two strong member companies with these prestigious awards.”
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IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.