Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
March 24, 2025 | ZukenEstimated reading time: 1 minute
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.
Zuken has also signed an agreement with IBM for the joint research and development of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3-D integrated circuit (3DIC) packaging design for advanced semiconductors and optimizing Electronic Design Automation (EDA) workflows. Zuken will support the evaluation of a prototype deep learning accelerator core from IBM’s digital and analog projects. Additionally, Zuken will contribute to material development and processes modeling, and integration assembly methods for interconnecting multiple IC dies within a semiconductor packaging module. The agreement will further focus on reliability testing, performance simulation, and hardware validation.
"Zuken is pleased to collaborate with IBM Research as a member of the AI Hardware Center and joint development partner," said Kazuhiro Kariya, Zuken's Senior Managing Executive Officer and CTO. "Our unique system-level design platform supports innovation in 3DIC heterogeneous integration design process by enabling a practical SOC/package/PCB co-design environment. Zuken aims to play an important role in the next-generation high-end device development ecosystem."
“We are thrilled to be working with Zuken to accelerate chip packaging and AI hardware innovation,” said Jeff Burns, Director of the IBM Research AI Hardware Center. “These advances will play a critical role in unlocking the performance and efficiency needed for the future of AI.”
Zuken views 3DIC packaging design as a key enabler for future technological innovation and continues to invest in R&D. Open collaboration with industry consortiums is critical, and our collaboration with IBM Research reflects our commitment to expanding technological capabilities and providing innovative solutions to our customers.
Share on:
Suggested Items
ESIA Statement on EU Funding for Competitiveness: A New Approach is Needed
05/09/2025 | ESIAThe European Semiconductor Industry Association (ESIA), representing the European leadership in semiconductor research, design, and manufacturing, would like to underscore the need for targeted and sustained investment to strengthen Europe’s strategic sectors.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
Hon Hai Research Institute Demonstrates Superiority of Shallow Quantum Circuits Beyond Prior Understanding
05/05/2025 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), in a milestone collaborative effort, has demonstrated that parallel quantum computation can exhibit greater computational power than previously recognized, with its research results accepted for publication in the prestigious journal Nature Communications.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
Meet Thiago Guimaraes, IPC's New Director of Industry Intelligence
05/05/2025 | Chris Mitchell, IPC VP, Global Government RelationsThe fast pace of innovation in the electronics manufacturing industry means business owners must continuously adapt their processes and capabilities to meet changing customer demands and market trends. To that end, IPC has hired Thiago Guimaraes as the new director of Industry Intelligence. In this interview, Thiago shares key goals and objectives that could revolutionize the industry as he helps stakeholders navigate industry trends and challenges.