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March 24, 2025 | DuPontEstimated reading time: 2 minutes
DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025. With a diverse portfolio of advanced circuit materials and solutions designed to push the limits of fine-line technology, signal integrity, and thermal management, DuPont will be exhibiting in Booth #8A31 at National Exhibition and Convention Center (NECC) from March 24-26.
"As artificial intelligence (AI), machine learning, and 5G technologies continue to advance, the demand for high-performance devices is propelling innovations in packaging substrates and high-end PCBs," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont. "With our cutting-edge materials and integrated solutions, we are helping PCB manufacturers meet the increasing needs for miniaturization, integration, and performance, paving the way for the next generation of AI-driven substrates. Our advancement in interconnect materials plays a critical role in enabling AI infrastructure to optimize speed, efficiency, and reliability."
DuPont is leveraging decades of expertise in material science to address the evolving demands of the rapidly expanding IC substrate and high-end PCB market, fueled by the surge from AI servers and data centers, networking, autonomous vehicles, and 5G. The IC substrate offerings encompass a wide array of solutions, including dielectrics, metallization chemistries for electroless copper seed layer, redistribution layer, copper pillars, solder bumps, and dry film imaging photoresists. This comprehensive portfolio tackles critical challenges in performance, miniaturization, reliability, and cost efficiency.
At the show, DuPont experts will be available at the company's booth to share their in-depth knowledge on technological innovations and industry trends. Attendees can explore DuPont's comprehensive solutions for the PCB market, featuring the following product offerings:
DuPont™ Circuposit™ SAP8000 electroless copper is an innovative SAP metallization technology designed for AI server CPU or GPU chip applications. This ionic-based catalyst electroless copper process is optimized for advanced packaging. It meets the demands for low-roughness dielectrics as well as low dielectric constant (Dk) and low dissipation factor (Df) properties essential for fine-line and high-frequency designs.
DuPont™ Microfill™ SFP-II-M acid plating copper is a novel pattern plating solution specifically designed to optimize pattern distribution for large AI chips. It is engineered to deliver consistent pattern distribution across large unit sizes, making it ideal for high-performance computing applications.
DuPont™ Riston® DI1600 & DI1600M dry film photoresist is an advanced fine line direct imaging photoresist solution specifically designed for IC substrate applications. It boasts exceptional fine line adhesion and resolution, paired with high-yield performance.
DuPont™ Riston® DWB8100M dry film photoresist is a high-performance direct imaging solution tailored for fine copper pillar and thick copper mSAP applications. It offers excellent fine line and via resolution, with strong bottom adhesion to minimize underplating risks. It ensures stable yield performance while providing a straight dry film and copper trace profile with low trace voids, making it optimal for advanced IC substrate applications.
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