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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
March 24, 2025 | DuPontEstimated reading time: 2 minutes
DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025. With a diverse portfolio of advanced circuit materials and solutions designed to push the limits of fine-line technology, signal integrity, and thermal management, DuPont will be exhibiting in Booth #8A31 at National Exhibition and Convention Center (NECC) from March 24-26.
"As artificial intelligence (AI), machine learning, and 5G technologies continue to advance, the demand for high-performance devices is propelling innovations in packaging substrates and high-end PCBs," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont. "With our cutting-edge materials and integrated solutions, we are helping PCB manufacturers meet the increasing needs for miniaturization, integration, and performance, paving the way for the next generation of AI-driven substrates. Our advancement in interconnect materials plays a critical role in enabling AI infrastructure to optimize speed, efficiency, and reliability."
DuPont is leveraging decades of expertise in material science to address the evolving demands of the rapidly expanding IC substrate and high-end PCB market, fueled by the surge from AI servers and data centers, networking, autonomous vehicles, and 5G. The IC substrate offerings encompass a wide array of solutions, including dielectrics, metallization chemistries for electroless copper seed layer, redistribution layer, copper pillars, solder bumps, and dry film imaging photoresists. This comprehensive portfolio tackles critical challenges in performance, miniaturization, reliability, and cost efficiency.
At the show, DuPont experts will be available at the company's booth to share their in-depth knowledge on technological innovations and industry trends. Attendees can explore DuPont's comprehensive solutions for the PCB market, featuring the following product offerings:
DuPont™ Circuposit™ SAP8000 electroless copper is an innovative SAP metallization technology designed for AI server CPU or GPU chip applications. This ionic-based catalyst electroless copper process is optimized for advanced packaging. It meets the demands for low-roughness dielectrics as well as low dielectric constant (Dk) and low dissipation factor (Df) properties essential for fine-line and high-frequency designs.
DuPont™ Microfill™ SFP-II-M acid plating copper is a novel pattern plating solution specifically designed to optimize pattern distribution for large AI chips. It is engineered to deliver consistent pattern distribution across large unit sizes, making it ideal for high-performance computing applications.
DuPont™ Riston® DI1600 & DI1600M dry film photoresist is an advanced fine line direct imaging photoresist solution specifically designed for IC substrate applications. It boasts exceptional fine line adhesion and resolution, paired with high-yield performance.
DuPont™ Riston® DWB8100M dry film photoresist is a high-performance direct imaging solution tailored for fine copper pillar and thick copper mSAP applications. It offers excellent fine line and via resolution, with strong bottom adhesion to minimize underplating risks. It ensures stable yield performance while providing a straight dry film and copper trace profile with low trace voids, making it optimal for advanced IC substrate applications.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?