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Real Time with... IPC APEX EXPO 2025: Delvitech Revolutionizing Factory Inspections With AI Technology
March 26, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
During IPC APEX EXPO 2025, Marcy LaRont interviewed Delivitech CEO Roberto Gatti. Delvitech showcased its groundbreaking Horus system at the show this year. Horus is the industry’s first all-in-one AI native platform for both AOI and SPI. This machine uses AI and a patented optical head for efficient factory inspections, analyzing components quickly and processing large data sets. Delvitech, founded in 2018, aims to replicate human eye capabilities in optical inspection.
The 25th IPC APEX EXPO, which took place March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn't make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
OKI Develops Tiling Crystal Film Bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
08/15/2025 | BUSINESS WIREOKI has successfully developed Tiling crystal film bonding technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.