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Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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Real Time with... IPC APEX EXPO 2025: LPKF's Advancements in Laser Depaneling Technology
March 25, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

In this recent interview, Jake Benz from LPKF Laser and Electronics discusses advancements in laser depaneling technology, focusing on speed and quality. He highlights the previous negative reputation of laser depaneling and shares insights from nearly two decades of experience. As customer needs evolve, traditional companies are exploring laser technology. Benz emphasizes the importance of optimizing designs for laser cutting efficiency and the critical role of software in enhancing laser operations.
The 25th IPC APEX EXPO, which took place March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
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The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.