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Real Time with... THECA 2026: Reliability Assessment Solutions Inc. on Smarter Electronics Testing

09/02/2026 | Real Time with... THECA
Bob Neves, CEO of Reliability Assessment Solutions Inc., examines how electronics companies can approach product reliability more realistically. Drawing on concepts from his book, The Printed Circuit Assembler’s Guide to...Via Structures: Reflow Process Survivability, Reliability, and Robustness, he describes the three Rs of via testing and reliability and stresses the importance of truly understanding the type of testing required in each specific use case. He warns that poorly aligned accelerated testing can lead to inaccurate life predictions, unnecessary over-engineering, and higher costs.

Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream

04/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
When engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not. 

Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale

02/25/2026 | BUSINESS WIRE
Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.
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