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25 Years of IPC APEX EXPO: Organizer Alicia Balonek Reflects on a Milestone
March 28, 2025 | Alicia Balonek, IPCEstimated reading time: 1 minute

As I celebrate my 25th work anniversary with IPC, I can’t help but reflect on my incredible journey. From its inception in 2000, IPC APEX EXPO has evolved into one of the most anticipated and dynamic events in the electronics industry, and I’m proud to have been a part of its growth every step of the way.
The Early Days: Building a Foundation
When IPC APEX EXPO first launched, the world of electronics was at a different stage of development. The rapid advancement of technology and the globalization of supply chains were just beginning to reshape the landscape. In those early years, managing the show required not only a clear vision but also an understanding of the industry's shifting needs. IPC, with its deep ties to the industry, was well-positioned to create a platform that could bring together key stakeholders—from engineers and designers to suppliers and manufacturers.
One of the most significant challenges in those early days was establishing IPC APEX EXPO as a must-attend event. Because we were competing against long-standing industry shows, we had to carve out a unique space for ourselves, offering not only a showcase of leading equipment manufacturers and suppliers but also valuable educational sessions and networking opportunities. The feedback we received from the first few events was overwhelmingly positive and affirmed that we were on the right path.
Adapting to Industry Changes: The Role of Technology and Innovation
Over the past 25 years, one of the most rewarding aspects of managing IPC APEX EXPO has been witnessing the rapid technological innovations that have shaped the electronics industry. From the rise of smart manufacturing and automation to the increasing emphasis on sustainability and green electronics, the industry has transformed. Each year, IPC APEX EXPO has had to adapt to these changes, ensuring that the show remains relevant and provides a space for industry leaders to address the most pressing issues of the time.
The show has become much more than just a trade show—it’s a reflection of the industry’s progress. We’ve seen companies debut revolutionary technologies that went on to reshape electronics manufacturing.
Continue reading this article in the Spring 2025 issue of IPC Community.
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Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.