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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Real Time with... IPC APEX EXPO 2025: Exploring Burkle's Innovations at IPC APEX EXPO 2025
March 27, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Burkle North America's Andy Turner shares insights from the show, highlighting the excitement surrounding the event and Burkle North America's growth potential. He invited attendees to their booth to interact with the InfoCube, a cutting-edge touchscreen showcasing Burkle's diverse product offerings. In this interview, Andy emphasizes the Burkle customer experience, engineering excellence, and the importance of the North American market.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Julia McCaffrey - NCAB GroupSuggested Items
Real Time with... APEX EXPO 2026: Exploring PCB Fabrication and Industry 4.0 Innovations with Burkle
02/23/2026 | Real Time with... APEX EXPONolan Johnson speaks with Andy Turner, CEO of Burkle North America, about PCB fabrication and pressing technologies. They discuss the significance of Industry 4.0, focusing on machine integration and data collection for improved manufacturing efficiency. The conversation covers Burkle's adoption of the Open Platform Communications Unified Architecture (OPC UA) protocol for better data sharing and the role of AI and automation in enhancing processes and customer interactions.
Real Time with... IPC APEX EXPO 2025: Insights from Andy Turner of Burkle North America
02/26/2025 | Real Time with...IPC APEX EXPOWith the upcoming IPC APEX EXPO 2025, Andy Turner, from Burkle North America, introduces the InfoCube, a cutting-edge display designed to showcase Burkle's diverse product offerings, including a glimpse into the inner workings of their machines.
IPC APEX EXPO 2024: Kurt Palmer on the Formation of Schmoll America
04/01/2024 | Barry Matties, I-Connect007There’s exciting news for Schmoll Maschinen as Kurt Palmer leaves his role as president of Burkle North America to lead the new Schmoll America. In this interview, Kurt discusses his collaboration with Burkle North America, what it means for his new Schmoll teams, and the many machines and processes he’ll have on display at his busy booth at IPC APEX EXPO.
Bürkle North America and Schmoll Maschinen Separating After 20 Years
03/25/2024 | Burkle North AmericaBürkle North America and Schmoll Maschinen, two leading companies supplying state-of-the-art equipment to Printed Circuit Board manufacturers, have announced an amicable separation, effective April 3.
Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2024
03/25/2024 | BenmayorBenmayor will exhibit Technosystem Automation at the IPC APEX EXPO 2024, a world-class trade show and cutting-edge technical conference in Anaheim, California, April 6-11, in booth 4432 at Burkle North America (Schmoll).