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A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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Real Time with... IPC APEX EXPO 2025: Transforming Engineering With Digital Solutions from Zuken
March 27, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Bob Potock discusses Zuken's focus on digital engineering and a move away from traditional document-based processes to model-based designs. This change improves product definition, reduces design errors, and optimizes product parameters. Bob notes that the IPC-2581 standard is crucial for connecting designs, while AI enhances design efficiency. Connected manufacturing links design outputs directly to machines, reducing human error. The concept of digital twins is also discussed, showcasing AI's role in design optimization.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Klaus Koziol - atgSuggested Items
Siemens Acquires ASTER Technologies to Deliver Industry-leading PCB Test Engineering Solutions
01/14/2026 | PRNewswireSiemens announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software.
Avnet Insights Survey: Engineers Embracing AI and Confronting Its Challenges
01/14/2026 | AvnetArtificial intelligence’s (AI) integration in designed products and solutions is here, and engineers are embracing the technology while identifying the challenges it may present.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
01/14/2026 | I-Connect007The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
ESD Alliance Reports Electronic System Design Industry Posts $5.6 Billion in Revenue in Q3 2025
01/13/2026 | SEMIElectronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Where Electronics Manufacturing Turns for Trusted Technical Insight
01/12/2026 | I-Connect007 Editorial TeamIn an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.