Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Beyond Design: The Metamorphosis of the PCB Router
Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
March 31, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
In this interview, Akrometrix president Neil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.
IPC Hall of Fame Spotlight Series: Highlighting Bob Neves
06/11/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
Rohde & Schwarz Satellite Industry Day 2025: Connecting the World with New Space and 5G NTN Technologies
05/27/2025 | Rohde & SchwarzAfter four successful online events with over 1000 participants, Rohde & Schwarz is hosting its fifth Satellite Industry Day on June 3, 2025, on-site at its Munich campus. Rohde & Schwarz test and measurement experts and partners from the industry will present topics from 5G Non-Terresterial Network (NTN) and satellite testing to monitoring and regulatory issues. During breaks participants can experience cutting-edge test and measurement solutions.