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Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
March 31, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
In this interview, Akrometrix president Neil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Würth Elektronik Expands Laboratory in Shenzhen, China
04/16/2026 | Wurth ElektronikWürth Elektronik eiSos Group celebrated the official opening of the Laboratory Phase II at its Asia Quality Design Center (QDC Asia) in Shenzhen on March 5, 2026.
Fuse Expands U.S. Radiation Testing Capacity with New Albuquerque Facility
04/13/2026 | PRNewswireFuse, a leading U.S.-based fusion company, announced the establishment of a new state-of-the-art facility in Albuquerque, New Mexico that will expand U.S. radiation effects testing capacity for critical defense, space, and semiconductor technologies.
Magnalytix Taps Metal Etch Services as Trusted Stencil Supplier for OE in a Box Kits
04/07/2026 | MagnalytixMagnalytix, providing real-time reliability solutions for electronics manufacturing, has chosen Metal Etch Services, Inc. as its stencil partner for OE in a Box kits.
Unitemp Launches ESPEC Deep Capacity HAST Chamber in UK for Large PCB Testing
03/24/2026 | UnitempA new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/18/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.