Sierra Circuits Inc. Chooses atg A9L Flying Probe Technology for High-speed Electrical Test
April 1, 2025 | atg Luther & Maelzer GmbHEstimated reading time: Less than a minute

atg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator Sierra Circuits Inc. in Sunnyvale, CA.
Consistent with the on-going investment in leading edge technologies at Sierra Circuits Inc., the A9L, 8 head, double-sided large format, high speed, high accuracy flying probe test system represents the latest addition to their test department. The new atg technology enables Sierra Circuits Inc. to test the latest ultra-fine designs while helping to reach industry leading throughput goals.
atg’s A9L can test pad sizes down to 35 micron and is capable of testing products up to a size of 36” x 26”. The A9L eliminates limitations due to test point density or fine-pitch contacts and features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ, HPOT and latent testing, in combination with a test speed of up to 230 measurements/second.
From their state-of-the-art PCB manufacturing facility in the heart of Silicon Valley, Sierra Circuits Inc. offers a complete line of PCB layout, fabrication, and assembly services. With almost 40 years of experience manufacturing highly complex PCB products, Sierra Circuits Inc. is one of the leading PCB manufacturers in North America.
Suggested Items
“Let’s Talk Production Test” with Bert Horner of The Test Connection, Inc. at SMTA Long Island Meeting
04/02/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce that its President, Bert Horner, will present at the SMTA Long Island Chapter Technical Meeting & Dinner on Wednesday, April 16, 2025. The event will take place at the Radisson Hotel Hauppauge in Hauppauge, NY.
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
04/02/2025 | TeradyneTeradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.
TRI Test Solutions at INNOELECTRO 2025
04/02/2025 | TRIAnytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.
Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
04/01/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
03/31/2025 | Real Time with...IPC APEX EXPONeil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.