Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
April 1, 2025 | Yamaha Robotics SMT SectionEstimated reading time: 2 minutes
Yamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
With the latest version of the YSUP-PG programming module, users can quickly get optimised programs without the need for producing test assemblies to verify correct settings. Working from standard data sources such as the PCB gerber file, assembly CAD data, and component libraries, YSUP-PG generates programs for each machine. With optimised settings and all necessary corrections automatically applied, program generation accelerates the beginning of production.
Yamaha’s YSUP factory automation tools present a unified framework and graphical environment for programming, optimising, and monitoring equipment in the 1 STOP SMART SOLUTION. Building the complete surface-mount line this way lets users choose from Yamaha’s portfolio of equipment designed from the ground up for easy interoperability and rich interactions that support quality assurance and traceability. Buyers can customise their line by selecting the desired machine type for each process and then choosing optional features such as the dispensing head, placement head, and inspection camera resolution.
Defining the future of the 1STOP SMART SOLUTION, the latest YR series dispensers, printers, mounters, and inspection systems share a common machine control system that ensures seamless and efficient integration and supports powerful features such as QA Options and Mobile Judgement. These help operators anticipate and solve production issues in real-time to avoid stoppages and maximise productivity.
In addition, the YR equipment generation shares an advanced chassis design that enhances rigidity and reliability. Thanks to this approach, the recently announced YRP10e entry-level screen printer achieves class-leading performance, 25% faster and with 40% greater printing accuracy than its predecessor. Similarly providing advanced stability for fast, accurate and repeatable component placement in YRM10 and YRM20 mounters, the same chassis is also featured in Yamaha’s YRi-V automatic optical inspection (AOI) systems. Here, the unwavering platform ensures pin-sharp image capture up to high scanning speeds, leading to short inspection times with high coverage and consistently high accuracy, ultimately delivering enhanced productivity.
Building on the foundation and interconnection established by sharing these underlying features, equipment in the 1 STOP SMART SOLUTION introduces features that simplify and accelerate assembly and inspection. Automated features including stencil loading and aperture cleaning in the YRP printers, nozzle maintenance, component checking, and pickup verification in YRM mounters ensure fast and error-free production of high-quality assemblies. The latest YRi-V 3D AOI systems with advanced lighting, optics, and image processing add refinements including automatic alignment checking to accelerate inspection of assemblies such as LED lighting and motor position sensors.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
Controlar Introduces PicAI to Strengthen Probe Inspection in Electronics Manufacturing
04/16/2026 | ControlarControlar is bringing a new level of precision and control to electronics testing with the launch of PicAI (AI-Driven Probe Inspection Control), a fully automated system designed to replace manual ICT fixture verification in high-reliability environments.
BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper
04/15/2026 | BEST Inc.BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.