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Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
April 1, 2025 | Yamaha Robotics SMT SectionEstimated reading time: 2 minutes
Yamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
With the latest version of the YSUP-PG programming module, users can quickly get optimised programs without the need for producing test assemblies to verify correct settings. Working from standard data sources such as the PCB gerber file, assembly CAD data, and component libraries, YSUP-PG generates programs for each machine. With optimised settings and all necessary corrections automatically applied, program generation accelerates the beginning of production.
Yamaha’s YSUP factory automation tools present a unified framework and graphical environment for programming, optimising, and monitoring equipment in the 1 STOP SMART SOLUTION. Building the complete surface-mount line this way lets users choose from Yamaha’s portfolio of equipment designed from the ground up for easy interoperability and rich interactions that support quality assurance and traceability. Buyers can customise their line by selecting the desired machine type for each process and then choosing optional features such as the dispensing head, placement head, and inspection camera resolution.
Defining the future of the 1STOP SMART SOLUTION, the latest YR series dispensers, printers, mounters, and inspection systems share a common machine control system that ensures seamless and efficient integration and supports powerful features such as QA Options and Mobile Judgement. These help operators anticipate and solve production issues in real-time to avoid stoppages and maximise productivity.
In addition, the YR equipment generation shares an advanced chassis design that enhances rigidity and reliability. Thanks to this approach, the recently announced YRP10e entry-level screen printer achieves class-leading performance, 25% faster and with 40% greater printing accuracy than its predecessor. Similarly providing advanced stability for fast, accurate and repeatable component placement in YRM10 and YRM20 mounters, the same chassis is also featured in Yamaha’s YRi-V automatic optical inspection (AOI) systems. Here, the unwavering platform ensures pin-sharp image capture up to high scanning speeds, leading to short inspection times with high coverage and consistently high accuracy, ultimately delivering enhanced productivity.
Building on the foundation and interconnection established by sharing these underlying features, equipment in the 1 STOP SMART SOLUTION introduces features that simplify and accelerate assembly and inspection. Automated features including stencil loading and aperture cleaning in the YRP printers, nozzle maintenance, component checking, and pickup verification in YRM mounters ensure fast and error-free production of high-quality assemblies. The latest YRi-V 3D AOI systems with advanced lighting, optics, and image processing add refinements including automatic alignment checking to accelerate inspection of assemblies such as LED lighting and motor position sensors.
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UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.