-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Molex Releases New Report on Strategies for Advancing Rugged, Reliable Connectivity in Modern Aerospace and Defense Applications
April 1, 2025 | MolexEstimated reading time: 3 minutes
Molex, a global electronics leader and connectivity innovator, has released a new report from AirBorn, a Molex company, which explores the unrelenting demands for constant, continuous connectivity to support the rigors of modern aerospace, defense and space-industry applications. The report, entitled "Defining and Advancing Rugged, Reliable Connectivity in Aerospace and Defense," addresses top connector design, development and testing requirements to ensure flawless performance despite prolonged exposure to extreme environmental, mechanical and thermal stressors.
"Pushing the boundaries of rugged and reliable connectors is paramount when lives depend on unfailing operation to complete critical missions," said Mike Cole, SVP and president, Aerospace and Defense Solutions, Molex. "This AirBorn report offers valuable insights on the need for interconnect innovations that elevate durability, signal integrity and long-term performance."
Engineering for Extreme Environments
Depending on the intended use, aerospace and defense connectors must be designed, manufactured and tested in accordance with military, space industry, reliability and manufacturing quality standards, including MIL-STD-202, MIL-STD-810, MIL-DTL-83513, MIL-STD-1344, NASA-STD-5019, NASA ASTM-E595, NASA EE-INST-002, ECSS-E-ST-10-03C, IPC-A-610 Class 3, IPC-620 Class 3 and AS9100.
Product design factors also are crucial to maintaining uninterrupted operations in land-, sea- and space-based systems. These include resilience to intense vibrations, high-impact shock forces, temperature extremes, along with protection against excess moisture, dust and contaminants. Equally important, aerospace and defense connectors must withstand hundreds or even thousands of mating cycles without failure. Corrosion from salt spray and oxidation also can cause rapid deterioration. The AirBorn report reinforces the need for gold plating to block oxidation and nickel underplating to protect against physical wear.
Cohesive Systems Ensure Long-Term Reliability
According to the AirBorn report, designing connectors for aerospace and defense requires precise alignment of multiple features—from mating cycles to shielding and sealing—as part of a holistic connector ecosystem. A precise balance is needed to combine capabilities while minimizing design trade-offs, whether enhancing sealing, strengthening latching mechanisms or adding more shielding.
Ensuring durability over time necessitates finding and alleviating key failure points while boosting mechanical resilience, environmental adaptability and operational longevity. The AirBorn report examines the need to optimize Electromagnetic Interference (EMI) shielding and signal integrity under conditions with high electrical noise. Additionally, the report details the role of sophisticated routing strategies that reduce crosstalk and signal degradation over long distances, as well as the importance of advanced shielding to maintain signal fidelity.
Sage advice on sustaining stable electrical connections is offered, including explanations on the long-term impact of engagement length, normal force, plating thickness and manufacturing precision. Additionally, descriptions of ruggedized connectors with multi-point contact systems illustrate the benefits of distributing mechanical loads during conditions of vibration and shock.
Selecting Materials for Performance and Durability
Delving into material selection, the AirBorn report explores how choices involving base alloys, plating thickness and housing material affect mechanical strength, electrical performance and long-term durability. Different materials used for connector contacts, plating and housings are explained, including beryllium copper (BeCu), phosphor bronze, brass, gold, nickel, steel, aluminum alloys, high-performance polymers and composite materials.
In addition, the report addresses the need for radiation-hardened (Rad-Hard) materials in connectors used in satellites, deep-space probes and high-altitude aerospace systems. Built to withstand prolonged exposure to ionizing radiation, these specially designed Rad-Hard connectors must resist radiation-induced embrittlement, conductivity loss and atomic oxygen erosion while maintaining reliability in vacuum environments.
Manufactured for Mission-Critical Standard
AirBorn's SInergy modular high-speed hybrid connectors merge high-speed, durability and adaptability into high-density interconnect systems that keep pace with evolving mission needs. Modular product design offers flexibility to configure connectors based on specific requirements—ranging from high-vibration military vehicles to thermally demanding avionics or high-radiation space applications.
The future of next-generation aerospace and defense systems depends upon continued connectivity advancements. Together, AirBorn and Molex are leveraging decades of experience and specialized expertise to drive ongoing developments of increasingly reliable, rugged solutions capable of sustaining top performance under the most extreme conditions.
Suggested Items
India-based Tech Vendors Must Prioritize Localization and Strategic Partnerships to Succeed in the Indian Market
04/28/2025 | IDCIndia’s technology market is evolving rapidly, and local tech vendors must prioritize AI investments, forge strategic vendor alliances, and navigate increasing regulatory challenges to seize new growth opportunities, according to the report, IDC Playbook Tech Sales Leaders - An India Technology Market Expansion Sales Playbook for India-Based Vendors.
Intel Restructures Leadership Under New CEO Lip-Bu Tan
04/22/2025 | I-Connect007 Editorial TeamIntel has announced a reorganization of its executive leadership under newly appointed CEO Lip-Bu Tan. Several core divisions—including the Data Center and AI Group and the Client Computing Group—will now report directly to Tan, streamlining the company’s reporting structure.
Cicor’s Shareholders Approve All Proposals
04/18/2025 | CicorThe Annual General Meeting approved the 2024 annual report, the annual financial statements, the consolidated financial statements, the report on non-financial matters and the appropriation of available earnings.
IPC Releases March 2025 Global Sentiment of the Electronics Manufacturing Supply Chain Report
04/02/2025 | IPCThis past March, electronics industry demand strengthened to its highest level in nearly a year, indicating strong expansion in customer and manufacturing activity according to IPC’s [IPC-Current-Sentimen-Global-EMSChain0525.pdf] March Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Murata Manufacturing Received the Award for Excellence at the Fourth Annual Nikkei Integrated Report Awards
04/02/2025 | Murata Manufacturing Co., Ltd.Murata Manufacturing Co., Ltd. received a high evaluation for the information disclosure made through our Murata Value Report (integrated report), leading to us being presented with the award for excellence at the fourth annual Nikkei Integrated Report Awards, organized by Nikkei Inc.