Elementary Mr. Watson: Navigating RF: A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
April 2, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
StencilQuik™ is custom-made to match the exact specifications of your components to ensure perfect alignment during rework. The stencil remains securely in place throughout the rework process, becoming an integral part of the PCB assembly. Manufactured from polyimide film with a high-temperature adhesive, this material resembles what is commonly used for bar code labels and for protecting gold fingers during wave soldering. StencilQuik™ is ESD-safe and has a residue-free adhesive backing that ensures a clean application.
An added benefit from this unique product is the ability to overcome solder mask damage which can occur during component removal. StencilQuik™ was designed to be placed over these damaged areas without the need for repair and still result in a successful component placement.
The StencilQuik™ rework process involves a few simple steps starting with preparing the rework site by removing any residual solder or flux residue following BGA removal. Next, remove the adhesive backed stencil and place it on the rework site by aligning the apertures with the corresponding pads. Once properly aligned, use a squeegee to fill each aperture completely with solder paste. After cleaning the residual paste off the stencil, place the component on top of StencilQuik™ and reflow for final placement.
As part of the IPC 7711 BGA rework processes, StencilQuik™ rework stencils have undergone extensive reliability testing confirming their dependability. Furthermore, third-party studies have validated that the surface insulation resistance (SIR) characteristics of BGAs placed using StencilQuik™ stencils, meet the acceptable standards for SIR values on PCB assemblies.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Technica's Innovations and Partnerships
04/11/2025 | Real Time with...IPC APEX EXPOJason Perry of Technica USA and Robert Beber of Reeco share about the engagement at their extra-large booth at this year's show, where they showcased 11 pieces of equipment and announced the new partnership for Technica with Reeco, supplier of ESD clothing and workbenches. With a positive industry outlook despite global trade uncertainties, Technica has plans to expand in North America.
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
02/06/2025 | MacDermid Alpha Electronics SolutionsIn an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.
PDR Offers Advanced Infrared Heating Technology for BGA Rework
12/02/2024 | PDRPDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4
09/11/2024 | I-Connect007 Editorial TeamIn this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.