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Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations

06/10/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies (FCT), a leading global provider of flexible circuit design, advanced interconnect solutions, and electronics manufacturing services, today announced the expansion of its manufacturing capabilities into Thailand, further strengthening its global supply chain and production network. 

Ventec Giga Named Worldwide Exclusive Distributor for Elinta Robotics

06/10/2026 | Ventec International Group
We are proud to announce that Ventec Giga has been appointed as the worldwide exclusive distribution partner for Elinta Robotics — a leading manufacturer of advanced automation equipment.

50 Years of Successful SPEA Testing Solutions

06/10/2026 | Nolan Johnson, SMT007 Magazine
SPEA is celebrating 50 years of test innovation, building on the vision of founder Luciano Bonaria, whose zero-failure philosophy continues to shape the company today. In this interview, Andrea Furnari, vice president of sales and marketing (based in Volpiano, Italy), and Dustin Warren, vice president and regional director (based in Dallas, Texas), reflect on that legacy while pointing to what’s next, from expanding global support to new developments in AI-driven test and high-performance platforms.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.