-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
epoxySet Introduces EC-1019 – Thermally Conductive, Crack Resistant Epoxy Potting
April 7, 2025 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces the EC-1019, specialized epoxy potting compound. This system utilizes unique chemistry and fillers to offer a thermally conductive compound that has very small particulate size of about 15um. The small particles allow it to penetrate and fill intricate voids. The thermal conductivity of 2.0 W/m°K makes for excellent heat dissipation in temperatures ranges of -40 to 220°C. The unique chemistry drastically reduces cracking compared with traditional, rigid materials. Its low CTE of 22 ppm/°C keeps stresses to a minimum.
It is used for tightly packed windings in motor stators/rotors, transformer coils and power supplies as well as other elaborate potting applications where thermal strain is a concern.
EC-1019 has excellent resistance to moisture and chemicals and is a superior electrical insulator. It is available in quart, gallon and pail kits with supply in about 2 weeks.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/16/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat
04/13/2026 | BoeingBoeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.
Technica USA and DCT Partnership Insights
04/10/2026 | Real Time with... APEX EXPOThis discussion features Jason Perry from Technica and David Bures from DCT Cleaning, highlighting Technica's expansion in PCB fabrication and assembly. DCT, a leader in cleaning solutions, emphasizes the renewed importance of cleaning in modern electronics due to miniaturization. Comprehensive offerings and an innovative approach to achieving optimal cleanliness is revealed.