Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Altus Supports Garner Osborne in Enhancing Component Management with Scienscope X-Ray Component Counter
April 8, 2025 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has supported Contract Electronics Manufacturer, Garner Osborne Circuits to further strengthen its component management capabilities with the installation of the Scienscope AXC-800 III X-ray Component Counter, strengthening the company’s inventory control capabilities.
Having maintained a strong partnership with Altus for many years, Garner Osborne consulted with the company to identify the optimal solution for enhancing their component management system. As a specialist in high-mix, low-medium volume manufacturing, the CEM identified specific operational challenge to address including unexpected stock level discrepancies, time-intensive manual counting processes, and the need for more accurate vendor component verification.
Altus facilitated an on-site trial of the Scienscope AXC-800 III, allowing the Garner Osborne team to evaluate its performance under real production conditions. Steve Honeybun, CEM Operations Director at Garner Osborne, said: “It was invaluable to have Altus provide a unit for on-site testing. This hands-on experience gave us confidence that we were selecting the best system for our needs. Given our long-standing relationship with Altus, we knew their support would be a major advantage compared to lower-cost alternatives.”
The Scienscope AXC-800 III offers rapid counting of up to four reels in less than 25 seconds, automated label reading and printing via an integrated smart camera, and exceptional accuracy for counting strips and partial reels. With a pre-installed database covering a vast range of components, the system ensures consistency and reliability in inventory tracking. Its advanced X-ray technology and AI-driven algorithms enable an exceptional accuracy rate of 99.99%, even for the smallest components.
Joe Booth, CEO of Altus Group, said: “Scienscope had a record year in the UK, and we were delighted to support Garner Osborne in this investment. The AXC-800 III has the largest component library available, and seeing it deliver results in a high-mix production environment reaffirms its value. Garner Osborne has made a series of smart investments, and it’s been rewarding to support them in optimising their processes.”
Following a successful trial, Garner Osborne invested in the Scienscope AXC-800 III. The implementation has already delivered tangible benefits, including improved inventory accuracy, reduced line stoppages, and a more streamlined counting process, strengthening their position as a leader in the UK electronics manufacturing sector.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.