Adaptsys, APP Systems Services Announce Strategic Partnership in Singapore
April 8, 2025 | AdaptsysEstimated reading time: 1 minute
Adaptsys has formed a strategic partnership with APP System Services, bringing our innovative Re-flex II inline carrier tape forming technology to customers in Singapore.
This collaboration represents an exciting step forward in our global growth and our commitment to providing localised support in one of Asia’s most vibrant electronics manufacturing markets.
Adaptsys is thrilled to announce our partnership with APP in Singapore, says Duncan Milroy, International Sales Manager at Adaptsys. This collaboration will allow us to bring our innovative Re-flex inline carrier tape forming technology directly to customers within Singapore. The Re-flex system, with its patented ability to form carrier tape inline, offers significant advantages by reducing material costs, simplifying logistics, and improving taping efficiencies for all users in the Singaporean market. We are confident that APP’s local expertise will provide excellent sales and support for our groundbreaking solution.
With APP’s strong local presence and technical knowledge, customers can now benefit from direct access to a solution that is reshaping tape and reel packing process for electronic components by delivering cost savings, greater efficiency, and reduced environmental impact.
Both companies will be exhibiting at SEMICON Southeast Asia in Singapore. You’ll find Adaptsys at Booth B1917 and APP System Services at Booth B1924. We welcome visitors to drop by or book a meeting with us to explore how Re-flex II can enhance your taping operations.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation
04/22/2026 | PRNewswireFlex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
Boeing, Millennium Scale Space Production to Meet Growing Demand
04/20/2026 | BoeingBoeing and its subsidiary Millennium Space Systems are expanding space production capacity and broadening their satellite portfolio to help government and commercial customers field capability faster and with greater flexibility.
Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.