Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Adaptsys, APP Systems Services Announce Strategic Partnership in Singapore
April 8, 2025 | AdaptsysEstimated reading time: 1 minute
Adaptsys has formed a strategic partnership with APP System Services, bringing our innovative Re-flex II inline carrier tape forming technology to customers in Singapore.
This collaboration represents an exciting step forward in our global growth and our commitment to providing localised support in one of Asia’s most vibrant electronics manufacturing markets.
Adaptsys is thrilled to announce our partnership with APP in Singapore, says Duncan Milroy, International Sales Manager at Adaptsys. This collaboration will allow us to bring our innovative Re-flex inline carrier tape forming technology directly to customers within Singapore. The Re-flex system, with its patented ability to form carrier tape inline, offers significant advantages by reducing material costs, simplifying logistics, and improving taping efficiencies for all users in the Singaporean market. We are confident that APP’s local expertise will provide excellent sales and support for our groundbreaking solution.
With APP’s strong local presence and technical knowledge, customers can now benefit from direct access to a solution that is reshaping tape and reel packing process for electronic components by delivering cost savings, greater efficiency, and reduced environmental impact.
Both companies will be exhibiting at SEMICON Southeast Asia in Singapore. You’ll find Adaptsys at Booth B1917 and APP System Services at Booth B1924. We welcome visitors to drop by or book a meeting with us to explore how Re-flex II can enhance your taping operations.
Share on:
Suggested Items
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Flex CEO Sees US Manufacturing Resurgence
06/18/2025 | I-Connect007In a June 16 interview on Bloomberg Open Interest, Flex CEO Revathi Advaithi said the supply chain is already shifting, with more goods now being manufactured in the U.S.