Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Maybank Becomes First Southeast Asian Bank to Grant Sustainability-Linked Loan to Austria’s AT&S

07/14/2025 | AT&S
Maybank announced it is granting a Sustainability-Linked Loan (SLL) amounting to USD150 million to Austria Technologie & Systemtechnik Malaysia (AT&S Malaysia).

Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids

07/09/2025 | Happy Holden -- Column: Happy’s Tech Talk
When we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/27/2025 | Nolan Johnson, I-Connect007
While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?

Meyer Burger Files for Insolvency for German Subsidiaries

06/02/2025 | Meyer Burger
The German subsidiaries of Meyer Burger Technology AG, Meyer Burger (Industries) GmbH and Meyer Burger (Germany) GmbH, have each filed for insolvency proceedings.

In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available

05/15/2025 | I-Connect007 Editorial Team
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in