Dan’s Biz Bookshelf ‘House of Huawei'
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
April 9, 2025 | DuPontEstimated reading time: 1 minute
DuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.
The Ikonic™ 9000 CMP pad series is a new expansion to DuPont’s Ikonic™ CMP product family, developed to enhance productivity and sustainability in semiconductor manufacturing processes for advanced chips. Ikonic™ 9000 pads have been recognized alongside other semiconductor innovations for AI and high-performance computing.
“Customers frequently turn to DuPont to tackle their next-generation technology challenges through advanced semiconductor materials,” said Sang Ho Kang, Vice President and General Manager, DuPont Semiconductor Technologies. “The development of Ikonic™ 9000 series pads is a successful outcome from addressing two critical needs for advanced node manufacturing—enhanced performance and more sustainable operations.”
Ikonic™ 9000 pads offer a high removal rate in CMP that leads to increased process throughput, and an advanced groove design aimed at maximizing slurry efficiency. At advanced fabrication nodes for chips supporting AI and high-performance computing, increased process complexity makes CMP efficiency especially important.
Additionally, the pads exhibit a longer operational life due to low wear rates, allowing for less frequent replacements and reduced downtime, optimizing production workflows. These features not only improve productivity, but also minimize waste, creating a more sustainable solution for semiconductor fabs.
“We are excited to see such a strong industry response to the launch of Ikonic™ 9000 pads, because they represent the start of a new wave of CMP innovation for performance, efficiency and sustainability,” said Randal King, Ph.D., Vice President of R&D/Technology, DuPont Electronics & Industrial. “DuPont is proud to be driving innovation across multiple new CMP pad and subpad families, and we look forward to launching more next-generation CMP pads to support advanced computing and AI.”
The Edison Awards™ is an annual competition honoring excellence in new product and service development, marketing, human-centered design, and innovation. Winners were selected from thousands of submissions and announced at the Edison Awards Gala in Fort Myers, Florida on Thursday, April 3, 2025.
Ikonic™ 9000 series CMP pads have been successfully placed at advanced technology nodes. Customers interested in learning more about Ikonic™ 9000 CMP pads or other opportunities to drive sustainability enhancements in their CMP processes should contact their DuPont account manager.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Eltek Ltd. Reports Strong Second-Quarter 2025 Results
08/14/2025 | PR NewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the quarter ended June 30, 2025.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.