-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
April 9, 2025 | DuPontEstimated reading time: 1 minute
DuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.
The Ikonic™ 9000 CMP pad series is a new expansion to DuPont’s Ikonic™ CMP product family, developed to enhance productivity and sustainability in semiconductor manufacturing processes for advanced chips. Ikonic™ 9000 pads have been recognized alongside other semiconductor innovations for AI and high-performance computing.
“Customers frequently turn to DuPont to tackle their next-generation technology challenges through advanced semiconductor materials,” said Sang Ho Kang, Vice President and General Manager, DuPont Semiconductor Technologies. “The development of Ikonic™ 9000 series pads is a successful outcome from addressing two critical needs for advanced node manufacturing—enhanced performance and more sustainable operations.”
Ikonic™ 9000 pads offer a high removal rate in CMP that leads to increased process throughput, and an advanced groove design aimed at maximizing slurry efficiency. At advanced fabrication nodes for chips supporting AI and high-performance computing, increased process complexity makes CMP efficiency especially important.
Additionally, the pads exhibit a longer operational life due to low wear rates, allowing for less frequent replacements and reduced downtime, optimizing production workflows. These features not only improve productivity, but also minimize waste, creating a more sustainable solution for semiconductor fabs.
“We are excited to see such a strong industry response to the launch of Ikonic™ 9000 pads, because they represent the start of a new wave of CMP innovation for performance, efficiency and sustainability,” said Randal King, Ph.D., Vice President of R&D/Technology, DuPont Electronics & Industrial. “DuPont is proud to be driving innovation across multiple new CMP pad and subpad families, and we look forward to launching more next-generation CMP pads to support advanced computing and AI.”
The Edison Awards™ is an annual competition honoring excellence in new product and service development, marketing, human-centered design, and innovation. Winners were selected from thousands of submissions and announced at the Edison Awards Gala in Fort Myers, Florida on Thursday, April 3, 2025.
Ikonic™ 9000 series CMP pads have been successfully placed at advanced technology nodes. Customers interested in learning more about Ikonic™ 9000 CMP pads or other opportunities to drive sustainability enhancements in their CMP processes should contact their DuPont account manager.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
New Podcast Episode: How Does UHDI Benefit SWaP?
10/01/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
October 2025 SMT007 Magazine: Upgrading Your Production Software
10/01/2025 | I-Connect007 Editorial TeamEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone? The October 2025 issue of SMT007 Magazine investigates business operations software and how best to achieve the necessary integrations.
Federal Electronics Successfully Completes AS9100 and ISO 9001 Surveillance Audit at Cranston Headquarters
09/30/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, announced the successful completion of its annual AS9100 and ISO 9001 surveillance audit at its headquarters in Cranston, Rhode Island.
IEMI 2026 in Bengaluru: Shaping the Next Era of Electronics
10/01/2025 | Arpita Das, Global Electronics AssociationIntegrated Electronics Manufacturing & Interconnections (IEMI) 2026, Jan. 29–30, at Taj Yeshwantpur, Bengaluru, builds on the success of IEMI 2024, which took place in both Kuala Lumpur and Bengaluru and attracted over 1,200 participants. From smart factory showcases to IPC-certified soldering competitions, it was a platform for knowledge exchange and technical engagement.
Federal Electronics Enhances Hermosillo Operations with Installation of Mycronic MyPro S30 Stencil Printer
09/29/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has expanded its production capabilities with the installation of a new Mycronic MyPro S30 Stencil Printer at its Hermosillo facility.