Nolan’s Notes: Automotive Is Gearing Up Again
Standard of Excellence: Engineering Collaboration Has Become the New Sales Strategy
Bridging the Pacific: Why Global Manufacturing Is No Longer Optional
Mike Sexton and Dustin Warren of SPEA explore market dynamics for PCBA manufacturers. They emphasize the need for optimizing testing processes, introducing deep In-Circuit Test (ICT) technology that identifies weak components often overlooked by traditional tests. The discussion also covers flying probe technology, highlighting its flexibility for high-mix, low-volume production and comparing it with ICT testing methods.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
