AIM Solder and India’s Persang Alloy Industries Announce Strategic Joint Venture
April 10, 2025 | AIM SolderEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 6 at the Crowne Plaza Milwaukee Airport, in Milwaukee, WI. AIM will be showcasing its cutting-edge soldering materials, including Type 5 solder paste offerings.
In celebration of emerging trends in electronics miniaturization, AIM is declaring 2025 the "Year of Type 5". With decades of experience producing high-quality solder pastes, including Types 4, 5, and 6, AIM is uniquely positioned to guide customers through the transition to finer powders. AIM products are developed with a focus on consistency, reliability, and process optimization, and are then coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating, driven by demand for precise, consistent soldering.
To learn more about AIM’s solder paste offerings and to discover all of AIM’s products and services, visit the company at the SMTA Wisconsin Expo & Tech Forum on May 6th.
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.