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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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The Key to First-pass Success in PCB Design
April 10, 2025 | Gerry Partida, Summit InterconnectEstimated reading time: 1 minute

In the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase.
Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
When issues surface late in the design cycle or during production, the costs of fixing them escalate exponentially. Redesigns, delays, and rework add unnecessary complexity and expense, while product reliability and time-to-market suffer. To avoid these challenges, collaboration needs to occur earlier in the design cycle, where issues can be proactively addressed.
Bridging the Knowledge Gap
PCB designers often focus on functionality, performance, and compliance with end-use requirements. Meanwhile, fabricators look at manufacturability, process efficiency, and cost optimization. Proactive collaboration between the OEM and the manufacturer ensures that requirements and capabilities are aligned from the outset, minimizing potential conflicts between design intent and fabrication results.
To read this entire article, which appeared in the March 2025 issue of Design007 Magazine, click here.
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The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
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PCB East Continues to Expand
05/06/2025 | Andy Shaughnessy, Design007 MagazineIt was a perfect week for a conference and trade show in metropolitan Boston, with high temperatures in the 70s. PCB East took place at the Boxboro Regency Hotel and Conference Center April 29–May 2, with the expo on April 30. PCB East has been expanding since its relaunch a few years ago, with conference and show attendance rising each year.
Green Circuits Expands Large-Format PCBA Capabilities with Installation of JUKI Primo Screen Printer
05/05/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, proudly announces the installation of the JUKI Primo Large-Format Screen Printer, expanding its capabilities to support printed circuit board assemblies (PCBAs) up to 33.5" x 24".