Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
April 15, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Things are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Finding Your Marketing Niche in a Crowded PCB Industry
03/10/2026 | Richard Nichols, GreenSource EngineeringI recently made a flippant comment on LinkedIn, “All marketing and no trousers,” hinting that marketing campaigns often do not have a tangible product to market and the campaign is marketing a concept or a gut feeling. For PCB and IC substrate manufacturers, this poses a great risk for unsuccessful campaigns and the opportunity to innovate in an increasingly competitive and global landscape.
Automation Meets Sustainability
09/08/2025 | Rick Nichols, GreenSource EngineeringGreenSource Engineering (GSE) is proud to have contributed to the first successful reshoring of a PCB facility on a greenfield site in the United States. While we are honored to have played a key role, full credit for this achievement goes to SEL for its vision, commitment, and professionalism.
SEL: Revolutionizing PCB Production Through MES, Partnerships, and Vision
08/21/2025 | Barry Matties, I-Connect007Two years ago, we visited Schweitzer Engineering Laboratories (SEL) to better understand its new captive greenfield PCB facility. We recently returned, this time to discuss how this bold vision has transformed the industry. Barry Matties met with John Hendrickson, engineering director, and Jessi Hall, vice president of vertical integration, to discuss the transformative capabilities of Factory Core, SEL’s custom manufacturing execution system (MES), which allows for real-time monitoring of workflow and machine performance, and has led to impressive improvements in quality and cost efficiency.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
12/22/2023 | U.S. Department of DefenseThe Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.