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Test Research, Inc. Honored with ASE Outstanding Supplier Award for 2024
April 15, 2025 | TRIEstimated reading time: Less than a minute
Test Research, Inc., is proud to announce that it has been recognized with the Outstanding Supplier Award from ASE Technology Holding Co., Ltd. This honor celebrates TRI’s decade-long collaboration with ASE and reflects a shared commitment to innovation, quality, and sustainable growth.
For the past 10 years, TRI has consistently delivered innovative and cutting-edge solutions to meet ASE’s evolving needs in semiconductor and advanced packaging production. TRI’s commitment to providing high-quality solutions has played a key role in helping ASE maintain its leadership as the world’s number one Outsourced Semiconductor Assembly and Test (OSAT) provider.
“It is a great honor for TRI to receive the ASE Outstanding Supplier Award,” said Jim Lin, Vice President of TRI. “This recognition reflects over a decade of mutual growth, shared values, and continuous innovation between TRI and ASE. We’re proud to contribute to ASE’s leadership in the semiconductor industry, and we look forward to continuing this meaningful partnership.”
TRI is committed to further innovation, continued excellence in optical inspection, and the development of new technologies to meet the challenges of the evolving semiconductor and packaging industries.
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06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
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The Evolution of Picosecond Laser Drilling
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