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Real Time with... IPC APEX EXPO 2025: Technological Advancements – IPC's Vision for 2025
April 16, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: 1 minute
Nolan Johnson introduces Matt Kelly, the CTO and VP Standards & Technology at IPC, who shares insights on recent organizational changes. He highlights the importance of proactive standards development to match the rapid pace of technology, predicting a tenfold acceleration in advancements over the next five years. IPC's core initiatives for 2025 focus on design, advanced electronics packaging, and digital manufacturing, aiming to create new guidelines and standards that meet industry demands.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Chemical Connection: When the Industry Moves Faster Than the Standards
04/29/2026 | Don Ball -- Column: The Chemical ConnectionAs a supplier of wet processing equipment, we have rules and standards we must adhere to, including both regional and national electrical codes and safety and environmental regulations, as well as myriad other standards to make the equipment safe to use. Things are a little different when it comes to rules and standards for manufacturing PCBs, though, because technical advances and requirements change so quickly that standards can’t keep up.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
UHDI Fundamentals: Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
PHOTO GALLERY: Putting in the Work on Standards, Professional Development
04/16/2026 | I-Connect007Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.