-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Elephantech: For a Greener Tomorrow
April 16, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Marcy LaRont: Nobu, can you explain this process of inkjet metallization?
Nobu Okamoto: We directly print on the substrate and then add the plating to reduce the etching and washing process for flexible printed circuit (FPC) production or rigid PCB production. We have already succeeded for three years in mass production and commercializing the single-layer FPC. I think this is a very rare case in printed electronics to have already been commercialized and succeeded.
At the end of last year, we successfully created a sample of multilayer FR-4. We are now looking for a partner to collaborate with on this project. Additionally, this technology can also be adapted for use with aluminum or glass substrates.
LaRont: So, is this for PCBs and some semiconductor packaging technology as well?
Okamoto: This is very fortunate because after we developed it for PCB manufacturing, we found that our printer, our ink, can print over glass, aluminum, or ceramics. Many customers are asking us, "Can you print on ceramic?” or "Can you print on glass?” because they are looking for many things, not just for the PCB. They are especially looking for semiconductor packaging or other applications. We are expanding our target customers and trying to solve the various customer requirements.
LaRont: What is the difference between copper, aluminum, and ceramic glass? Is there trouble with adhesion?
Okamoto: For the moment, the whole material complies with IPC standards. As I mentioned, we are trying to make electronics sustainable; that's why we are providing the solutions. We can develop different solutions for other requirements. This may include a different ink, printer, or primer.
LaRont: If a customer has a request, you want to partner with them to create a solution?
Okamoto: Yes, but we are a very small company, so we would like a real partner. For my part, I would appreciate some testing or something similar. It can be quite challenging, but if businesses are facing issues and would like to resolve them using our technology, we are always open to collaboration.
LaRont: That's really important. If you want to add value in electronics manufacturing today, you really have to be in that space where you'll partner with your customers on NPI and such.
Okamoto: Until today, it's been quite difficult because our biggest advantage is sustainability. Everybody says that sustainability is very important, but it's really tough to make decisions, especially in the FPC and PCB areas. We have already established a net-zero target internally, and the European side is expressing concerns about this. This is a good time to consider implementing this manufacturing method, which typically takes two to three years. It’s an excellent opportunity to aim for a target year of 2030 or 2035.
LaRont: I agree that everybody's talking about it but having trouble doing it. If you know anything about inkjet technology, you know there's a lot less waste and so much less copper. What are the sustainability benefits of your technology?
Okamoto: We don't have any washing and etching process so we can reduce water consumption by 95%. No etching means fewer chemical contaminants. As a result, we can reduce 75% CO2 emissions.
LaRont: That's quite a lot of green right there.
Okamoto: Also, many people consider green technology expensive, but copper and water are very expensive resources now. With our technology, you can reduce copper by 70%, so your manufacturing costs should be lower.
LaRont: We're approaching the point where it will be just as costly not to do it.
Okamoto: The advantage of our technology is we use 100% of the copper ink and the copper plating, so it can be possible to directly replace what our customers are using now. There's no compromise.
LaRont: Requalification is one thing, but there’s no need to redesign?
Okamoto: No need to redesign.
LaRont: Nobu, it sounds like exciting technology. Hopefully we'll hear more about it in the future.
Okamoto: Thank you very much.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Enhancing Reliability in Harsh Environments
11/18/2025 | Real Time with...SMTAISLB is a leading technology OEM in the energy sector, providing technology, equipment, and services to support oil exploration, drilling, production, and processing. This is big business, and the technology can be complex. Chintan Sanghani—a new voice in SMT007 Magazine—is SLB’s expert in quality and process improvement, and I had the opportunity to meet him while in Chicago in October.
Ynvisible Reports Commercial Momentum and Expanding Market Engagements in 2025/2026
11/18/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leading provider of ultra-low power printed e-paper display solutions, is pleased to provide an update on its commercial activities and market engagement for 2025.
Voices of the Industry Features Elephantech’s Satoshi Konagai on the Future of Sustainable PCB Manufacturing
11/17/2025 |I-Connect007 is pleased to announce the release of the latest episode in its acclaimed podcast series, Voices of the Industry. In this episode, host Marcy LaRont speaks with Satoshi Konagai, Executive Officer and Head of Marketing of Elephantech, about the company’s groundbreaking additive manufacturing technology that’s reshaping the printed circuit board (PCB) industry.
Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
11/17/2025 | Sydney Xiao, Global Electronics Association East AsiaDiscussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/14/2025 | Nolan Johnson, I-Connect007I read an interesting article this week about a breakthrough on building microprocessors to run on microwaves rather than traditional digital circuitry. It cites an academic study that begins, “The development of high-bandwidth applications, including multi-gigabit communication and radar imaging, demands faster processing. However, in the microwave regime, where frequencies exceed clock rates, sampling and computation become challenging. Here we report an integrated microwave neural network for broadband computation and communication.”