-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Elephantech: For a Greener Tomorrow
April 16, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes

Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Marcy LaRont: Nobu, can you explain this process of inkjet metallization?
Nobu Okamoto: We directly print on the substrate and then add the plating to reduce the etching and washing process for flexible printed circuit (FPC) production or rigid PCB production. We have already succeeded for three years in mass production and commercializing the single-layer FPC. I think this is a very rare case in printed electronics to have already been commercialized and succeeded.
At the end of last year, we successfully created a sample of multilayer FR-4. We are now looking for a partner to collaborate with on this project. Additionally, this technology can also be adapted for use with aluminum or glass substrates.
LaRont: So, is this for PCBs and some semiconductor packaging technology as well?
Okamoto: This is very fortunate because after we developed it for PCB manufacturing, we found that our printer, our ink, can print over glass, aluminum, or ceramics. Many customers are asking us, "Can you print on ceramic?” or "Can you print on glass?” because they are looking for many things, not just for the PCB. They are especially looking for semiconductor packaging or other applications. We are expanding our target customers and trying to solve the various customer requirements.
LaRont: What is the difference between copper, aluminum, and ceramic glass? Is there trouble with adhesion?
Okamoto: For the moment, the whole material complies with IPC standards. As I mentioned, we are trying to make electronics sustainable; that's why we are providing the solutions. We can develop different solutions for other requirements. This may include a different ink, printer, or primer.
LaRont: If a customer has a request, you want to partner with them to create a solution?
Okamoto: Yes, but we are a very small company, so we would like a real partner. For my part, I would appreciate some testing or something similar. It can be quite challenging, but if businesses are facing issues and would like to resolve them using our technology, we are always open to collaboration.
LaRont: That's really important. If you want to add value in electronics manufacturing today, you really have to be in that space where you'll partner with your customers on NPI and such.
Okamoto: Until today, it's been quite difficult because our biggest advantage is sustainability. Everybody says that sustainability is very important, but it's really tough to make decisions, especially in the FPC and PCB areas. We have already established a net-zero target internally, and the European side is expressing concerns about this. This is a good time to consider implementing this manufacturing method, which typically takes two to three years. It’s an excellent opportunity to aim for a target year of 2030 or 2035.
LaRont: I agree that everybody's talking about it but having trouble doing it. If you know anything about inkjet technology, you know there's a lot less waste and so much less copper. What are the sustainability benefits of your technology?
Okamoto: We don't have any washing and etching process so we can reduce water consumption by 95%. No etching means fewer chemical contaminants. As a result, we can reduce 75% CO2 emissions.
LaRont: That's quite a lot of green right there.
Okamoto: Also, many people consider green technology expensive, but copper and water are very expensive resources now. With our technology, you can reduce copper by 70%, so your manufacturing costs should be lower.
LaRont: We're approaching the point where it will be just as costly not to do it.
Okamoto: The advantage of our technology is we use 100% of the copper ink and the copper plating, so it can be possible to directly replace what our customers are using now. There's no compromise.
LaRont: Requalification is one thing, but there’s no need to redesign?
Okamoto: No need to redesign.
LaRont: Nobu, it sounds like exciting technology. Hopefully we'll hear more about it in the future.
Okamoto: Thank you very much.
Suggested Items
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
05/27/2025 | PromexPromex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).
COMPUTEX 2025 Concludes Successfully AI Deployment Accelerates as Taiwan Solidifies Its Strategic Global Position
05/23/2025 | PRNewswireCOMPUTEX 2025 concluded today after four days of dynamic exhibitions and events. The show welcomed an impressive turnout, with 86,521 buyers from 152 countries, including Japan, the United States, South Korea, Vietnam, and India.
Imec Joins Forces with MIT’s RLE, MTL and IMES to Accelerate Personalized Healthcare
05/23/2025 | ImecImec, a leading research and innovation hub in nanoelectronics and digital technologies announced their collaboration with Massachusetts Institute of Technology (MIT), a renowned research university in advanced technology and science to research nanoelectronics-based solutions for minimally and non-invasive diagnostic devices for personalized medicine.