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EIPC Summer Conference 2025: PCB Innovation in Edinburgh
April 18, 2025 | EIPCEstimated reading time: Less than a minute
EIPC have very wisely selected the wonderful city of Edinburgh, Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
Day 1 opens with a look at Business Outlook and Market Forecasts, moving on to Sustainability and Recycling, Materials for Tomorrows Technologies, and Manufacturing in a Circular Economy Industry.
Day 2 covers Advanced HDI to Medical and Chiplet Substrates and Thermal Management Solutions and Training on new Surface Finish processes.
As usual, there will be a truly international team of speakers, and as usual the unique atmosphere of an EIPC Conference will be based upon the convocation of convivial compatriots. Join them, there is everything to gain. Including the chance of knowing what a good dram tastes like.
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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Optimum Energy Powers Up Partnership with Conference USA
10/17/2025 | BUSINESS WIREOptimum Energy, a leading energy as a service provider for higher education, announced it will serve as a premier corporate sponsor for Conference USA (CUSA).
Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
09/22/2025 | Global Electronics AssociationThe Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.