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DuPont Announces Additional Directors for the Planned Independent Electronics Company
April 18, 2025 | DuPontEstimated reading time: Less than a minute
DuPont announced that Karin De Bondt and Anne Noonan will become members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont, which is targeted for November 1, 2025.
Ms. De Bondt is Senior Vice President and Chief Strategy Officer for Trane Technologies, a global climate innovator that brings efficient and sustainable climate solutions to buildings, homes and transportation.
Ms. Noonan served as President and Chief Executive Officer of Summit Materials, a construction materials company, from September 2020 to February 2025 and is a member of the board of directors for CF Industries.
"With the announcement of these two future board members, we've established an exceptional nine-member board to guide the future Electronics company, and completed a critical milestone in our separation planning," said Alexander M. Cutler, DuPont's Lead Independent Director. "Karin and Anne bring deep experience in executive leadership, capital allocation, mergers and acquisitions, governance and risk management. We look forward to the strong contributions and invaluable perspectives they will bring to the future Electronics company."
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Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
07/31/2025 | UCLA NewsroomA new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA.
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,