-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Material Selection and RF Design
April 21, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

Innovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.
Andy Shaughnessy: Alun, just give us a quick refresher: How are RF materials different from traditional PCB laminates?
Alun Morgan: RF covers a broad range of frequencies, often defined as the spectrum from 3 KHz to 300 GHz. At the low end, traditional materials are fine; however, the influence of the material becomes much more critical as frequency increases.
Shaughnessy: How does RF differ from HSD (high-speed digital)?
Morgan: They are two different worlds, with very different design requirements. RF is primarily concerned with the propagation of analog waveforms, whereas HSD is primarily concerned with the transmission of binary digital bitstreams. Each has its particular benefits and drawbacks. The good news is that materials designed for high-speed digital applications are also generally suitable for high-frequency analog circuits.
Shaughnessy: What do PCB designers moving into the RF space need to understand about material selection?
Morgan: There are some very specific electrical properties that are important when selecting materials for RF or HSD applications. The first is the dielectric constant (Dk) of the material. The Dk is the ability of the substrate to store electric energy in an electrical field. It is a dimensionless property and is quoted as a value relative to a vacuum, which has a Dk of 1. Why does it matter? It matters because it determines transmission speed and must be accounted for when calculating the timing and synchronization of high-speed signals; it is also crucial for impedance matching and control. The Dk is very much a design consideration, and specific designs may require higher or lower values.
To read this entire article, which appeared in the April 2025 issue of Design007 Magazine, click here.
Suggested Items
Taiwan's PCB Industry Chain Is Expected to Grow Steadily by 5.8% Annually in 2025
05/05/2025 | TPCAAccording to an analysis report jointly released by the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's International Industrial Science Institute, the total output value of Taiwan's printed circuit (PCB) industry chain will reach NT$1.22 trillion in 2024, with an annual growth rate of 8.1%.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand
05/05/2025 | I-Connect007 Editorial TeamDuPont reported higher-than-expected earnings for the first quarter of 2025, supported by increased demand in its electronics and industrial segments. The company’s adjusted earnings per share came in at 79 cents, surpassing the average analyst estimate of 65 cents per share, according to data from LSEG.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.