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Advanced Electronics Packaging Digest

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Fraunhofer IPMS Showcases New Technologies for the Future of Semiconductor Industry

11/03/2026 | Fraunhofer IPMS
At SEMICON Europa 2026, the Fraunhofer Institute for Photonic Microsystems IPMS will showcase current research results and technological developments for the semiconductor industry.

AI Inference Boosts CPU and DDR5 Demand Amid MLCC Shortages Through 1H27

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Flip Electronics Announces Authorized Distribution Partnership with Intelligent Memory

10/28/2026 | PRNewswire
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SEMI Forecasts 11.8% Growth in Silicon Wafer Shipments in 2026

10/22/2026 | TrendForce
Global silicon wafer shipments are projected to increase 11.8% in 2026 to 14,420 million square inches (MSI), SEMI reported in its annual silicon shipment forecast. Shipments are expected to reach successive record highs from 2027 through 2029, rising to 17,034 MSI by the end of the forecast period. 

Samsung Electro-Mechanics Signs KRW 360.5 Billion Package Substrate Supply Deal

10/21/2026 | Samsung Electro-Mechanics
Samsung Electro-Mechanics has signed a long-term supply agreement (LTA) worth KRW 360.5 billion for 'Memory Semiconductor Package Substrates' with a global major corporation.
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