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NY CREATES, Fraunhofer Institutes Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale

05/16/2025 | NY CREATES
NY CREATES and Fraunhofer IPMS announced at a signing ceremony a new Joint Development Agreement (JDA) to drive research and development focused on memory devices.

SMC Korea 2025 to Spotlight Next-Generation Memory and Materials Innovation amid AI Boom

05/13/2025 | SEMI
The Strategic Materials Conference (SMC) Korea 2025 is set to convene on May 14 at the Suwon Convention Center in Gyeonggi-do, South Korea, bringing together leading experts and innovators to highlight the critical role of materials innovation in addressing the performance, efficiency, and scalability requirements of AI-enabled semiconductor devices.

OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.

Micron Announces Business Unit Reorganization to Capitalize on AI Growth Across All Market Segments

04/23/2025 | Micron
Micron Technology, Inc., a leader in innovative memory and storage solutions, announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.

In-Memory Computing: Revolutionizing Data Processing for the Modern Era

04/21/2025 | Persistence Market Research
In a world where milliseconds matter, traditional computing architectures often struggle to keep up with the massive influx of real-time data.
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