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Altus Honours Scienscope with ‘Fastest Growing and Most Dynamic Supplier’ Award
April 22, 2025 | Altus GroupEstimated reading time: 2 minutes
Altus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, has awarded Scienscope, a global provider of high-quality inspection equipment, with the ‘Fastest Growing and Most Dynamic Supplier’ recognition, celebrating their dynamic growth and innovative approach to electronics manufacturing solutions.
The award was presented by Richard Booth, Chairman and Founder of Altus Group and Danutek Group Companies, to Eddy Linn and Jean Wu of Scienscope at the recent IPC APEX EXPO 2025.
Altus and Scienscope partnered in 2018 to introduce 2D X-ray and X-ray counter technology into the European market. At the time, Scienscope was launching its first generation AXC-800 X-ray Counter, marking the start of a partnership that has grown rapidly over the years.
By 2025, Scienscope has established its European headquarters in Romania, developed a range of 2D X-ray solutions, and expanded into component management technologies, including goods-in scanning, smart storage, in batch as well and automated versions.
Richard Booth, Founder and Chairman of Altus and Danutek Group Companies said: "Looking back at how our partnership has developed, it’s something we’re really proud of. We always aim for success in every partnership we start, but it takes two partners who are aligned and share the same ambitions for that to happen. Ultimately, it’s about a supplier who consistently invests in development, enabling us to find new ways to support their growth and customer acquisition. For me, the shift towards developing a suite of component management solutions and becoming a market leader in that space has been critical to their success. Given that this area is still under-invested across our markets, it will continue to drive our success in the years to come as the technology becomes more widely adopted."
Today, Altus and Danutek sell nearly $2 million worth of Scienscope products annually, reflecting the strength of the partnership built on Scienscope's focused R&D efforts and Altus Group's robust sales and marketing support. This collaboration has played a key role in the companies’ mutual success.
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Cyberattack via Ransomware at Major EMS Provider Foxconn
05/15/2026 | I-Connect007 Editorial TeamA recent cyberattack targeting Foxconn has once again exposed the growing vulnerability of global manufacturing and electronics supply chains to ransomware operations. According to CyberScoop, the attack disrupted operations at several of Foxconn’s North American facilities, temporarily forcing some production activities into manual workarounds while systems were restored.
Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.