-
-
News
News Highlights
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada
April 25, 2025 | IPCEstimated reading time: 1 minute
IPC, the global electronics association, announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth.
In this role, Schneider is responsible for ensuring that the needs of this vital region’s electronics industry are clearly understood and served by IPC and accomplished by developing strong relationships with regional membership, customers, and partners along with providing exceptional service delivery and identifying new business opportunities throughout the electronics eco-system.
With an impressive resume, Schneider brings more than two decades of executive experience with very successful roles and increasing responsibility in the EMS industry (Flex, Sparton) and the medical devices industry (Abbott, Siemens Healthcare). Immediately prior to joining IPC, he served as the vice president of commercial operations, health solutions for Flex in Buffalo Grove, Ill. While there, he led multi-site operations responsible for medical device, equipment and drug delivery for the healthcare industry.
“As our members, partners and other industry stakeholders meet Joe and see him in action, it will become very apparent that developing strong relationships with our targeted community and finding creative ways to address their challenges are part of his natural DNA. We look forward to him implementing the right strategies to better know the industry and in parallel fulfill our mission to serve the membership,” said Sanjay Huprikar, IPC’s chief global officer.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Global Electronics Association Expands Free Member Training Library with New Safety and Ergonomics Courses
04/23/2026 | Global Electronics AssociationThe Global Electronics Association today announced three new complimentary courses in safety and ergonomics, expanding its member training library to help manufacturers onboard workers faster and improve production performance.
A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
04/23/2026 | I-Connect007 Editorial TeamI-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time With… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains
04/22/2026 | I-Connect007 Editorial TeamA new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.