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Candor Elevates PCB Fabrication Services with Continued Facility Upgrades
April 28, 2025 | Candor CircuitsEstimated reading time: 2 minutes
Ontario-based circuit board manufacturer, Candor Circuit Boards has recently completed a series of facility upgrades to improve their PCB offerings. These investments will allow Candor to provide higher volumes of complicated boards more efficiently with better yield. The new technology has allowed the company to take on exciting high technology projects and collaborations in industries such as Military and Aerospace, Medical, Energy and more.
Microcraft Craftpix CPQ inkjet and mask system
What this means for Candor is more speed. CraftPix is a UV curing type inkjet printer which completes the task of both printing and curing of the ink in one machine. It also increases Candor’s quality by applying extremely accurate solder mask deposit with no defects.
Indubond X-Press 360
The X-Press is a multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates using induction heating that yields minimal delay in heat transfer, high heat up rates, extremely high temperatures with high temperature balance on any direction of the press stack X, Y and Z axis, ensuring consistency of quality throughout the board.
DIS OLS – M
DIS’s SmartWeld™ Induction Technology coupled with Optical Alignment will allow Candor to eliminate mechanical tooling and improve process flexibility by decreasing operational cycle times and reducing operating costs while delivering better layer to layer registration than conventional pin systems.
Schmoll PicoFlex Drill
The high-energy picosecond laser enables cold and precise material removal, minimizing thermal damage and preserving material integrity. The Schmoll drill will allow Candor to utilize a wide range of materials and will customize for their different needs, making it a valuable tool for some of Candor’s more intricate projects.
KLA Nuvogo 600
Nuvogo will allow Candor mass production with the capability to image fine-line structures on nearly every resist type, delivering maximum flexibility. The system will provide high imaging quality and high throughput for applications such as high-density interconnect (HDI), flex and advanced multi-layer boards (MLB).
CIMS Phoenix FLEX/HDI
AOI inspection of fine line flex and rigid-flex PCB capable of scanning down to 15 µm line/space width technology, allowing Candor to meet rigorous detection requirements.
atg a5 neo
Atg’s 8 Head test system will allow Candor to test a wider range of rigid and flexible products with the functionality of quick standard Electrical Test or if necessary can be equipped with the latest test functions to achieve the highest test specifications available on the market.
Pluritec’s Ecospray DS
Ecospray’s double sided spray coating technology will help Candor to dramatically reduce cycle time from hours to minutes, increasing productivity and lowering cost.
In regard to the recent technology advancements, Candor’s Technical Sales Manager, Sunny Patel stated, "At Candor, we are constantly driving forward, and our recent facility upgrades represent a significant leap in our commitment to our customers. By integrating state-of-the-art technologies like precision laser drilling, advanced direct imaging, induction lamination, and sophisticated AOI and electrical testing systems, we are strategically positioning ourselves to meet the evolving demands of high-tech industries. This investment isn't just about new machines; it's about fundamentally expanding our capabilities for more complex and intricate board designs, drastically improving quality through enhanced accuracy and process control, and significantly increasing our production throughput with better yield. For our clients in critical sectors like Aerospace, Medical, and Energy, this translates to receiving higher-technology boards, faster, and with the reliability they depend on. We're equipped and eager to tackle the next generation of PCB challenges."
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Nolan’s Notes: UHDI—Raising Awareness and Interesting Questions
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IEC Announces Sale of Flying Test Probe From atg Luther & Maelzer to Candor Industries Inc.
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I-Connect007 Editor’s Picks: Five Must-Reads for the Week
06/10/2022 | Nolan Johnson, I-Connect007PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.
Candor Nails the ROI With InduBond
06/07/2022 | Nolan Johnson, I-Connect007Nolan Johnson follows up on his original interview with Sunny Patel, engineering manager at Candor Industries, about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine. Capabilities and energy use are two things that are significantly better, but has there been a positive impact on throughput? Sunny explains.