-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025
April 29, 2025 | congatecEstimated reading time: 2 minutes

Congatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8. At Booth A10, congatec will demonstrate its application-ready ecosystems designed to simplify and accelerate the development of embedded applications, boosting future competitiveness in practically every Australian industry sector.
“Market leadership is increasingly dependent on the utilization and integration of the latest electronics into all aspects of manufacturing, production, assembly, systems development, maintenance, and services”, explains Kathryn Chan, country manager for Australia and New Zealand at congatec. “Standardized hardware and software building blocks like aReady.COM based on Computer-on-Modules simplify the design of innovative applications and provide a secure upgrade path to implement future technologies.”
Visitors can expect to see a broad range of congatec Computer-on-Modules (COMs) and solution platforms that address the growing demands for performance, security, connectivity, and agility in embedded applications.
Experience aReady.COM – Play the Game!
Visit the congatec booth to experience the power of aReady.COM in an interactive and engaging way! The aReady.COM game lets visitors explore the benefits of application-ready software building blocks and discover how to streamline the development process.
COM-HPC Client Ecosystem: High performance, ready for application
congatec's COM-HPC Client ecosystem, featuring the conga-aCOM/mRPL, delivers exceptional performance for demanding embedded applications. This ecosystem is designed to accelerate time-to-market with application-ready solution platforms, providing scalable performance to meet evolving application needs. The ecosystem also enhances design flexibility with a wide range of carrier board options and increases reliability for mission-critical applications.
Passively cooled edge server for harsh environments
The rugged edge server design based on the conga-HPC/sILH COM-HPC Server module and the conga-HPC/uATX-Server application carrier board is engineered for reliable operation in challenging environments where fanless, fully sealed systems are essential. The design ensures robust performance in extreme temperatures and conditions, increases system reliability through passive cooling, minimizes maintenance, and maximizes uptime with its fanless operation. This makes it ideal for industrial automation, outdoor installations, and critical infrastructure.
SMARC Ecosystem: Compact and powerful
congatec's SMARC ecosystem, including the new conga-SMX95 modules, provides compact, energy-efficient modules for applications where optimized size and power consumption are critical. With a small form factor for space-constrained applications, low power consumption for energy efficiency, and scalable options to fit various performance needs, they are ideal for mobile systems, IoT devices, and embedded vision.
COM Express Ecosystem: Performance and legacy support
congatec's COM Express Type 6 ecosystem, featuring the new conga-TC750 modules, delivers high performance for demanding applications. Adherence to the industry-standard COM Express form factor ensures compatibility with existing designs, while long-term availability supports efficient product lifecycle management. These attributes make the modules well-suited for industrial control, medical imaging, and communication systems.
Suggested Items
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.
Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.