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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Inspectis Launches XYZ Motorized Positioning System

11/09/2026 | INSPECTIS AB
Inspectis AB has introduced an XYZ Motorized Positioning System for its precision digital microscope systems, it is announced today, and will exhibit the new product at the ELECTRONICA show in Munich, Germany, in Stand A4.124.

Teledyne Brown Wins Next Generation Interceptor Support Equipment Subcontract

11/09/2026 | BUSINESS WIRE
Teledyne Brown Engineering, Inc., a subsidiary of Teledyne Technologies Incorporated and a leader in advanced engineering and manufacturing solutions, was awarded a sub-contract by Lockheed Martin in support of the Next Generation Interceptor (NGI) mission. Under the award, Teledyne will deliver NGI mechanical ground support equipment to Lockheed Martin.

Fabrinet Announces Q1 Fiscal Year 2027 Financial Results

11/05/2026 | Fabrinet
Fabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its first fiscal quarter ended September 25, 2026.

University of Massachusetts Lowell Wins Top Prize in Bright Electronics Manufacturing Challenge 2026

11/05/2026 | SMTA
The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the final results of the Bright Electronics Manufacturing Challenge 2026.

Key Tronic Reports Q1 FY2027 Results Amid Supply Chain Financing Constraints

11/04/2026 | Key Tronic Corp.
For the first quarter of fiscal year 2027, Key Tronic reported total revenue of $98.7 million, compared to $98.8 million in the same period of fiscal year 2026.
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