-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
April 30, 2025 | ElephantechEstimated reading time: 1 minute
Japanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing. As the first milestone of the new direction, Elephantech has signed its second Memorandum of Understanding (MoU) with Taiwan-based LITE-ON Technology Corporation (LITEON), deepening their strategic partnership in advancing environmentally responsible electronics production.
Building on strong recognition for its sustainable proprietary PCB technology SustainaCircuits, Elephantech took a strategic expansion from pure in-house PCB production to solution business, which empowers partners to adopt and scale decarbonizing manufacturing processes within their own facilities. This shift highlights dissemination of Elephantech’s core technology and positions the company for broader adoption and long-term growth.
Through this move, Elephantech aims to accelerate industry-wide sustainability, in alignment with LITEON’s vision for green manufacturing. Announced on Earth Day (April 22), the renewed collaboration centers on transfer of Elephantech’s proprietary technology to LITEON’s cooperative factories for production line upgrades. Following the first MoU focusing on FPC applications in 2023, the partnership has evolved in both scope and depth to transform the supply chain toward net-zero carbon emissions. Together, the two companies will continue to validate and demonstrate scalability of Elephantech’s SustainaCircuits technology for mass production across diverse applications.
Shinya Shimizu, Representative Director & CEO of Elephantech commented: “We are deeply impressed by LITEON’s commitment to innovations and reducing carbon footprint since our first partnership in 2023. We are also excited to reach this new agreement on implementation of our rigid PCB equipment and materials, which we believe will become a global standard for resource-efficient production, and we are striving to realize it.”
Roger Chen, Director of LITEON+, the company’s startup platform, added: “With the signing of our second MoU with Elephantech, we’re moving beyond early-stage product applications into equipment investment. Through embedding Elephantech’s solutions into our operations, we will jointly strengthen the industry’s sustainable competitiveness.”
Looking ahead, Elephantech views this milestone as a launchpad for its next phase of development. The company will continue evolving its business and partnership models, actively pursuing new opportunities to maximize the impact of its low-environment-impact innovations across products and industries — driving meaningful progress toward a truly sustainable future.
(Left) Vicky Liang, Head of Intelligent Peripheral Solution from LITEON; (right), Shinya Shimizu, CEO of Elephantech
Suggested Items
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.