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Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
April 30, 2025 | ElephantechEstimated reading time: 1 minute
Japanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing. As the first milestone of the new direction, Elephantech has signed its second Memorandum of Understanding (MoU) with Taiwan-based LITE-ON Technology Corporation (LITEON), deepening their strategic partnership in advancing environmentally responsible electronics production.
Building on strong recognition for its sustainable proprietary PCB technology SustainaCircuits, Elephantech took a strategic expansion from pure in-house PCB production to solution business, which empowers partners to adopt and scale decarbonizing manufacturing processes within their own facilities. This shift highlights dissemination of Elephantech’s core technology and positions the company for broader adoption and long-term growth.
Through this move, Elephantech aims to accelerate industry-wide sustainability, in alignment with LITEON’s vision for green manufacturing. Announced on Earth Day (April 22), the renewed collaboration centers on transfer of Elephantech’s proprietary technology to LITEON’s cooperative factories for production line upgrades. Following the first MoU focusing on FPC applications in 2023, the partnership has evolved in both scope and depth to transform the supply chain toward net-zero carbon emissions. Together, the two companies will continue to validate and demonstrate scalability of Elephantech’s SustainaCircuits technology for mass production across diverse applications.
Shinya Shimizu, Representative Director & CEO of Elephantech commented: “We are deeply impressed by LITEON’s commitment to innovations and reducing carbon footprint since our first partnership in 2023. We are also excited to reach this new agreement on implementation of our rigid PCB equipment and materials, which we believe will become a global standard for resource-efficient production, and we are striving to realize it.”
Roger Chen, Director of LITEON+, the company’s startup platform, added: “With the signing of our second MoU with Elephantech, we’re moving beyond early-stage product applications into equipment investment. Through embedding Elephantech’s solutions into our operations, we will jointly strengthen the industry’s sustainable competitiveness.”
Looking ahead, Elephantech views this milestone as a launchpad for its next phase of development. The company will continue evolving its business and partnership models, actively pursuing new opportunities to maximize the impact of its low-environment-impact innovations across products and industries — driving meaningful progress toward a truly sustainable future.
(Left) Vicky Liang, Head of Intelligent Peripheral Solution from LITEON; (right), Shinya Shimizu, CEO of Elephantech
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