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Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field

09/09/2025 | Elephantech
Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.

Elephantech Launches World’s Smallest-Class Copper Nanofiller

07/17/2025 | Elephantech
Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.

Elephantech, Logitech Together Drive Disruptive Electronics Innovation

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Elephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.

LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability

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LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.

Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
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