Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Panasonic Factory Solutions Consolidates Core Operations in Eastern Europe

09/23/2026 | Panasonic Factory Solutions
Panasonic Factory Solutions is strengthening its presence in Central and Eastern Europe by centralising its customer support, engineering, service and development activities in Budapest, Hungary.

Blackfox Launches Redesigned Website

09/22/2026 | Blackfox Training Institiute
Blackfox, an IPC Authorized Training Center and a leading provider of IPC training and certification services, has launched a redesigned website at www.blackfox.com, built to get customers from a question to a scheduled class in fewer steps. The site is available in English and Spanish and works the same on a phone as on a desktop.

Hon Hai Education Foundation, NTNU Promote AI Education in High Schools

09/11/2026 | Foxconn
The Taichung City Government Education Bureau and Taipei City jointly launched a teacher training workshop.

Koh Young America’s Ray Welch Marks 100th Advanced Solder Paste Inspection and Print Process Training Class

09/10/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, is celebrating an important customer training milestone as Ray Welch, Sr. Applications Engineer at Koh Young America, recently delivered his 100th SPI Level 2 Print Process training class.

CAE, WB Electronics Advance Unmanned Systems Training Collaboration

09/09/2026 | PRNewswire
CAE and WB Electronics, a leading company in Poland's defence sector specializing in advanced technologies, announced the signing of a Memorandum of Understanding (MoU) at MSPO 2026.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in