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KYZEN’s Adam Klett to Present at 2025 SMTA Electronics in Harsh Environments Conference
May 5, 2025 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that Director of Science Adam Klett, PhD will present during the technical conference at the 2025 SMTA Electronics in Harsh Environments Conference. The event is scheduled to take place May 20-22, 2025 at the DoubleTree Amsterdam Central Station.
Klett, who also serves on the conference’s technical committee, will present “Impact of Testing Delays on Contamination Detection in Electronic Assembly Cleaning,” on Monday, May 20 at 4 PM.
The presentation covers a study investigating the effect of time elapsed between manufacturing and testing on contamination detection and reproducibility of results. The goal of the study was to determine whether the delay compromises the reliability of conclusions about cleaning effectiveness.
As presented by Klett, the results of the study provide quantitative insights into the effect of time on the detectability of contamination and the reproducibility of SIR test results. The findings of the study thereby enable manufacturers to better understand how scheduling delays may influence test outcomes.
The SMTA Electronics in Harsh Environments Conference, hosted by SMTA Europe, addresses a wide variety challenges and best practices for designing and manufacturing electronics devices to perform reliably when used in harsh environments. The 2025 conference features three days of technical programming including a keynote presentation each day.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.