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IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
May 8, 2025 | IPCEstimated reading time: 1 minute
IPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
In this role, Huprikar is responsible for enhancing alignment, efficiency and support between IPC’s global headquarters and regional teams. Initially reporting into Huprikar are the vice president of international relations and vice presidents of U.S. and Canada, Europe, India and Southeast Asia regions. Collaborating with his team, Huprikar will work to ensure that the needs of each region’s electronics industry are clearly understood and served by IPC.
Huprikar joined IPC in 2012 as vice president of member success. Since then, he has taken roles of increasing responsibility and leadership and most recently served as president of Europe and South Asia operations and led IPC’s globalization initiative to expand the association’s standards, education, and advocacy support to Europe, the United Kingdom, India, and several countries in Southeast Asia including Malaysia, Singapore, Indonesia, and the Philippines.
“Sanjay is a highly experienced business and engineering professional. He has strong cross-cultural leadership skills and vast knowledge of both the key influencers in the global community and the important challenges facing the industry,” said John W. Mitchell, IPC president and CEO. “Through his leadership, regional teams will be better enabled with more resources, greater input and enhanced collaboration for furthering IPC’s mission to build a resilient, sustainable and prosperous global electronics industry.”
Huprikar is based at IPC’s corporate headquarters in Bannockburn, Ill., and can be reached at SanjayHuprikar@ipc.org.
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EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
04/21/2026 | Alison James and Chris Mitchell, Global Electronics AssociationThe European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
Industry-Wide Memory Constraints Grow as AI-Driven Supply Shift Reshapes Market
04/13/2026 | Global Electronics AssociationArtificial Intelligence is consuming a growing share of the world’s memory supply, leaving electronics manufacturers across industries facing longer lead times, rising prices, and increasing uncertainty, according to a new report released today from the Global Electronics Association.