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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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SEMI Urges Congress to Extend Section 48D Tax Credit

07/23/2026 | SEMI
SEMI, the global industry association serving the semiconductor and electronics design and manufacturing supply chain, brought together executives from member companies for advocacy meetings on Capitol Hill focused on extending the tax credit for investments in building up the U.S. semiconductor ecosystem.

CIL Awarded Investors in People

07/14/2026 | CIL
Custom Interconnect Ltd (CIL), a leading provider of Outsourced Semiconductor Packaging and Test (OSAT), EMS and full product build solutions, is proud to announce that it has been awarded the highly respected Investors in People (IIP) Accreditation, recognising the company's commitment to supporting, developing, and empowering its employees.

A Roadmap to Faster SMT Changeovers

07/14/2026 | Nolan Johnson, SMT007 Magazine
The top-performing EMS providers—Jabil, Flex, Sanmina, Benchmark, Zollner, and Asteelflash—consistently focus on a foundational Lean manufacturing methodology known as SMED (single-minute exchange of die) to reduce equipment setup and changeover times to under 10 minutes. The four SMED pillars: Offline feeder preparation, Feeder cart exchange systems, Barcode/MES verification, and Dedicated setup technicians. These four changes alone typically deliver 60–80% of total achievable setup time reduction before more advanced automation is even considered.

July SMT007 Magazine Focuses on Setup Optimization

07/01/2026 | I-Connect007 Editorial Team
The fastest way to improve your uptime is by reducing setup time. That means transforming setup from a machine-centered activity into a logistics-centered process where materials, feeders, programs, and tooling arrive at the line fully validated before the previous job ends. The result is faster changeovers, less labor waste, and greater efficiency through single-minute exchange of die (SMED). In the July 2026 issue of SMT007 Magazine, we examine how manufacturers are applying SMED principles to reduce downtime, increase throughput, and improve overall equipment effectiveness.

Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.
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