Delta Builds First IPC-CFX Demonstration Line in Asia-Pacific
May 14, 2025 | Chuck Li, IPC North AsiaEstimated reading time: Less than a minute

IPC-CFX (Connected Factory Exchange) is a globally leading universal data exchange designed to enable efficient collaboration and real-time data exchange between devices and systems. As a key standard in the global electronics manufacturing industry, IPC-CFX has been implemented in various regions worldwide, providing the foundation for digital factory solutions. In the Asia-Pacific region, IPC actively promotes this standard, helping enterprises enhance efficiency and competitiveness through digital transformation.
As a leading manufacturer of power supplies and thermal management solutions, Delta Electronics has established multiple electronics assembly production lines globally. Building on 50 years of manufacturing experience and over 30 years of industrial control technology, Delta has been continuously advancing its global smart manufacturing projects for more than a decade.
Starting in early 2024, Delta began requiring its equipment suppliers to meet Delta's equipment networking specification. This requirement has effectively driven the adoption and implementation of IPC-CFX by equipment manufacturers in the EAS industrial supply chain, enhancing interoperability among equipment.
Learn more in the Spring 2025 issue of IPC Community.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.