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Advanced Electronics Packaging Digest

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North American EMS Shipments Rise 6.7% in June as Book-to-Bill Reaches 1.33

07/29/2026 | Global Electronics Association
The Global Electronics Association announced today the June 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.33.

Micross to Acquire AEMtec, Expanding European Advanced Packaging

07/29/2026 | PRNewswire
Micross Components, Inc., a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, announced that it has entered into a definitive agreement to acquire AEMtec GmbH (AEMtec).

PCB Industry Momentum Continues with 12% Shipment Growth and Strong Book-to-Bill

07/29/2026 | Global Electronics Association
The Global Electronics Association announced today the June 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.49.

Kaney Announces $2.88 Million Investment to Expand BGT Aerospace Operations in Freeland

07/20/2026 | Kaney, Inc.
Kaney, Inc., a Velocity One portfolio company, today announced a $2.88 million investment in its BGT Aerospace facility in Freeland, Michigan, expanding manufacturing capacity, adding advanced production equipment, and reinforcing the company's long-term commitment to the local community

Will This PCB Material Still Be Available in 30 Years?

06/16/2026 | Laura Martin, Isola
One of the most common questions I receive from aerospace and defense customers has nothing to do with dielectric constant, dissipation factor, or thermal performance. Instead, the conversation often starts with a simple question: "If we design this material into our platform today, will it still be available in 30 years?"
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