Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
NEDME 2025 Announces Diverse and Distinguished Speaker Lineup
May 19, 2025 | ASC SunstoneEstimated reading time: 1 minute
The Northwest Electronics Design & Manufacturing Expo (NEDME) is thrilled to announce the impressive speaker lineup for the upcoming 2025 event. Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center in Hillsboro, Oregon, NEDME 2025 will feature a dynamic array of thought leaders from across the electronics design and manufacturing sectors.
Keynote and Featured Speakers
- James Clarke - Director of Quantum Hardware, Intel Corporation
- Lupita Maurer - President, Polar Instruments
Session and Panel Speakers
- Kevin Beattie - Production Manager, ASC Sunstone Circuits
- Debbie Benke - Director of Quality Assurance, Axiom Electronics
- Dr. Isil Berkun - Founder, DigiFab AI
- Pat Duggan - Sales Engineer and Distribution Manager, Temco Northwest
- Mike Galloway - Sr. Manufacturing Engineer, Screaming Circuits
- Darren Hitchcock - Sr. Business Development Manager, Panasonic Electronic Materials
- Jim Kaigh - Outsourced VP of Growth, Sales Xceleration
- Gregory Kovsky - President, International Business Associates (IBA)
- Brandon Patton - President, Lakehouse Industries
- Gabrielle Proust - Principal, The Efficiency Godmother
- Mike Schindele - Director of Operations, DZYNE Technologies
- Mark Veary - Director of Engineering, Fusion EMS
- Jerry Vieira - President & Founder, The QMP Group
- Justin Wagner - Patent Attorney, McCoy Russell LLP
- Blaine Watson - Director, designPORT
- Leonard Weitman - Principal Consultant, Weitman Consulting
- Angela Wilhelms - President & CEO, Oregon Business & Industry (OBI)
- Laura Zager - Director, IP Counsel for Software and AI, Thermo Fisher Scientific
Event Details
- Date: Wednesday, October 22, 2025
- Time: 8:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, Hillsboro, OR
Exhibitor Registration: Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now. Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics sector.
For more information and to secure your spot, visit www.nedme.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference was well received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year is the Design Pavilion and Technology Theater, bringing commercial value to technical discussions and highlighting the critical role of timely standards development in rapidly evolving sectors like AI and automotive.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/17/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.