Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

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As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.

Indium Corporation is a trusted expert in power device packaging, delivering a broad portfolio of advanced material solutions designed to support every stage of assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly. Central to these innovations is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), offering high-reliability, flux-free soldering solutions tailored for the demands of next-generation power electronics.

Indium Corporation will showcase a wide range of cutting-edge solutions designed to meet the thermal, mechanical, and reliability demands of modern power electronics systems, including:

• InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
• Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• InTACK® is a no-clean, no-residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining.
• Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, they enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting steps.
• NC-809 is Indium Corporation’s first no-clean, ultra-low residue, ball-attach flux on the market. It is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
• SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.